24 October 2017

Wacker Chemicals presents DEHESIVE range

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Wacker Chemicals (stand A55) will exhibit its new series of DEHESIVE® products produced and developed for release agents and other substrates. The DEHESIVE® release solution has excellent releasing performance adjustable with a range of 1~1400g/inch releasing force. During the processing, DEHESIVE® solution also has fantastic leveling, good adhesiveness with substrates and prompt curing etc.

Besides of conventional solvent-free and solvent products, Wacker Chemicals will also launch a series of dispersions at Labelexpo Asia to meet the more and more severe environment production policies with customers. DEHESIVE® silicone emulsions have very good cutting stability and excellent wettability and it could accomplish first-rate releasing effect with very few coating spread. Customers can choose applicable DEHESIVE® product or solutions according to the type of substrate, surface performance and coating technology. 

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